Overview
Sintered copper paste is an advanced bonding material composed of nano/micro copper particles, organic binders, and solvents. Unlike conventional solders, it forms metallurgical bonds through solid-state diffusion during sintering, creating joints with near-bulk copper properties. This technology addresses limitations of lead-free solders in high-power applications, offering 3-5x higher thermal conductivity (≥200 W/mK) and superior reliability under thermal cycling. The sintering process typically occurs at 200-300°C under pressure, though some formulations enable low-temperature sintering (<200°C).
Physical and Chemical Properties
The paste exhibits thixotropic behavior for precise dispensing, with viscosity ranging from 50,000-200,000 cP. After sintering, density reaches 85-95% of pure copper, with porosity <5%. Electrical resistivity measures 2-5 μΩ·cm, approaching bulk copper's 1.68 μΩ·cm. Key formulation variables include particle size (10nm-10μm), shape (spherical/flaky), and organic content (5-20wt%). Smaller particles enhance sintering activity but increase oxidation risk. Advanced formulations incorporate anti-oxidation agents to enable air sintering without protective atmospheres.
Main Applications
Primary use is die-attach in power modules (IGBTs, SiC/GaN devices), where it replaces solders in automotive inverters, industrial motor drives, and renewable energy systems. The material withstands operating temperatures exceeding 250°C and thermal cycling from -40°C to 200°C. In LED packaging, it minimizes thermal resistance between chips and heat sinks, improving lumen maintenance. Emerging applications include 3D chip stacking and RF device packaging, where its high conductivity and fine-pitch capability (<50μm bond lines) are advantageous.
Safety and Storage
Copper nanoparticles may pose inhalation hazards; use fume hoods or N95 masks during handling. The paste is flammable due to organic solvents - store away from ignition sources at 5-30°C. Unopened containers typically have 6-12 month shelf life. Post-sintering, joints exhibit excellent chemical stability but may tarnish in sulfur-containing environments. For critical applications, consider protective coatings. Waste disposal should follow local regulations for copper-containing materials.
B2B Procurement Guide
Specify particle characteristics (D50, size distribution), as these dictate sintering behavior and final porosity. Require datasheets with measured thermal/electrical conductivity values, not theoretical estimates. For automated dispensing, verify compatibility with your equipment's needle sizes (typically 18G-25G). Bulk purchases (1kg+) often reduce costs by 20-30%. Leading suppliers include Heraeus, Indium Corporation, and NBE Technologies, with Asian manufacturers offering competitive pricing for standard grades.
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