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Samsung DRAM Memory Chip

Updated: 2026-08-02

Overview

The K4B2G1646C-HCH9 is a DDR3 SDRAM memory module manufactured by Samsung, designed for industrial and embedded applications. With a capacity of 2Gb (256MB), it offers reliable performance in demanding environments. This memory chip operates at 1.5V and features a 64Mx16 organization. Its industrial-grade construction makes it suitable for applications requiring extended temperature operation and long-term availability.

Structure and Working Principle

K4B2G1646C-HCH9 电子元器件 SAMSUNG三星 封装BGA96 原装正品深圳市中芯巨能电子有限公司

The K4B2G1646C-HCH9 utilizes synchronous dynamic random-access memory technology with double data rate architecture. Internally, it consists of multiple memory banks that can be accessed independently for improved performance. The module communicates with the host system through a 16-bit data bus, transferring data on both the rising and falling edges of the clock signal. This design effectively doubles the data transfer rate compared to single data rate memory technologies.

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Key Features

Key features include a clock frequency of 800MHz (DDR3-1600 equivalent), CAS latency of 11 cycles, and auto refresh capability. The module supports burst lengths of 8 for efficient data transfer. Notable is its industrial temperature range (-40°C to +85°C), making it suitable for harsh environments. The device also includes on-die termination (ODT) for improved signal integrity in high-speed applications.

Application Areas

Primary applications include industrial PCs, networking equipment, medical devices, and automotive systems where reliability is critical. It's commonly found in programmable logic controllers (PLCs) and embedded computing platforms. The memory is also used in telecommunications infrastructure, including base stations and routing equipment. Its stable performance under varying temperature conditions makes it ideal for outdoor and industrial installations.

Maintenance and Precautions

K4B2G1646C-HCH9 电子元器件 SAMSUNG 封装BGA 批次26+深圳市诚利顺电子科技有限公司

Proper handling requires ESD protection measures during installation. Avoid mechanical stress on the package and ensure proper alignment when inserting into sockets. Thermal management is important for optimal performance. While the device can operate in extended temperature ranges, adequate ventilation or heatsinks may be required in high-density installations. Avoid exposure to moisture and corrosive environments.

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B2B Procurement Guide

When procuring K4B2G1646C-HCH9 modules, verify the manufacturer's part number and revision. Industrial buyers should request documentation of temperature range validation for critical applications. Consider lead times as industrial-grade components may have longer production cycles. For high-volume purchases, negotiate directly with authorized distributors or the manufacturer for better pricing and supply chain stability.

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