PLCC32

Updated: 2026-07-19

Overview

The PLCC32 is a standardized surface-mount IC package designed for automated assembly processes. It belongs to the Plastic Leaded Chip Carrier family, characterized by its square shape with 32 J-shaped leads (8 per side). The package measures approximately 11.43mm x 11.43mm, making it suitable for space-constrained applications. Developed as an alternative to dual in-line packages (DIPs), the PLCC32 offers superior board space utilization while maintaining through-hole compatibility via socket adapters. Its plastic construction provides adequate thermal and mechanical protection for most commercial-grade ICs, including microcontrollers, memory chips, and interface controllers.

Structure and Working Principle

The PLCC32 package consists of a plastic body encapsulating the silicon die, with 32 outward-extending leads arranged in a gull-wing (J-lead) configuration. The leads are spaced at 1.27mm (50 mil) pitch, complying with JEDEC standards. The J-lead design provides mechanical compliance to absorb thermal expansion stresses during soldering and operation. Internally, the IC die is bonded to a lead frame using wire bonding techniques. The plastic encapsulation material (usually epoxy) provides environmental protection while allowing heat dissipation. The package typically withstands soldering temperatures up to 260°C for 10 seconds, compatible with reflow and wave soldering processes.

Key Features

The PLCC32 offers several advantages for electronics manufacturers. Its compact footprint (about 45% smaller than equivalent DIP packages) enables higher PCB component density. The J-lead design provides self-centering during placement and better solder joint reliability compared to flat leads. Standardization across manufacturers ensures compatibility with universal PLCC sockets and rework tools. The package supports automatic optical inspection (AOI) due to its exposed leads. Typical operating temperature ranges from -40°C to +85°C, suitable for most commercial applications. Some variants include windowed versions for UV-erasable EPROMs.

Application Areas

PLCC32 packages are extensively used in industrial controls, telecommunications equipment, automotive electronics, and consumer devices. Common applications include microcontroller units (MCUs), flash memory, EEPROMs, programmable logic devices (PLDs), and interface chips like UARTs or GPIO expanders. The package is particularly favored in legacy system upgrades where through-hole DIP packages are being replaced with surface-mount equivalents. Its socket compatibility allows for field-replaceable components in test equipment and serviceable industrial systems. Some military-grade components use ceramic variants (CLCC) for higher reliability in harsh environments.

Maintenance and Precautions

When handling PLCC32 components, avoid excessive force on leads to prevent deformation. Use ESD precautions during installation. For soldering, recommended reflow profiles peak at 240-250°C for leaded solder or 245-255°C for lead-free, with time above liquidus (TAL) of 60-90 seconds. For rework, use dedicated PLCC extraction tools to avoid PCB pad damage. Thermal shock should be minimized—preheat packages to 100-150°C before soldering if they've been stored in cold environments. When cleaning, avoid ultrasonic methods which may damage wire bonds; instead use spray or immersion cleaning with compatible solvents.

B2B Procurement Guide

When sourcing PLCC32 components, verify JEDEC MO-047 compliance to ensure dimensional standardization. Key specifications to confirm include lead pitch (1.27mm), body size (11.43mm square), and lead material (tin or tin-lead plating). For high-reliability applications, request moisture sensitivity level (MSL) ratings—typically MSL 3 for standard packages. Minimum order quantities (MOQs) commonly start at 1,000 pieces, with price breaks at 10k and 100k units. Lead times vary from stock availability to 8-12 weeks for custom configurations. Consider secondary market options for obsolete parts, but insist on traceability documentation.