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MPF100T-1FCVG484E

Updated: 2026-08-30

Overview

The MPF100T-1FCVG484E is a mid-range FPGA from Microsemi’s PolarFire® family, offering 100K logic elements in a 484-pin FBGA package. It targets applications requiring a balance of performance, power efficiency, and security. Unlike traditional FPGAs, it uses a non-volatile flash-based configuration, eliminating the need for external boot memory. This makes it suitable for mission-critical systems where instant-on capability is essential.

Structure and Working Principle

MPF100T-1FCVG484E 电子元器件 MICROCHIP 规格书 资料深圳市芯汇达电子实业有限公司

The FPGA comprises configurable logic blocks (CLBs), DSP slices, and embedded memory, interconnected via a programmable routing matrix. Users define functionality using HDL (Hardware Description Language) or schematic entry. The device’s flash technology ensures configuration retention without power, reducing system complexity. It also supports partial reconfiguration, allowing dynamic updates to specific logic regions while the rest remains operational.

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Key Features

1. **Low Power**: Consumes up to 50% less power than SRAM-based FPGAs, ideal for battery-operated devices. 2. **Security**: Built-in anti-tamper features like AES-256 encryption and physically unclonable functions (PUFs). 3. **Radiation Tolerance**: Qualified for space applications (e.g., satellites) with latch-up immunity. Additional features include hardened PCIe controllers and high-speed transceivers (up to 12.7 Gbps).

Application Areas

**Industrial**: Motor control, PLCs, and robotics. **Telecom**: 5G infrastructure and baseband processing. **Aerospace**: On-board satellite processing and avionics. Its reliability and extended temperature range (-55°C to +125°C) suit harsh environments.

Maintenance and Precautions

REF3112AIDBZR 电压基准IC TI 输出电压 工作温度 时钟频率深圳市芯汇达电子实业有限公司

**ESD Protection**: Use grounded wrist straps during installation. **Thermal Design**: Ensure adequate heat dissipation; TJmax is 125°C. **Firmware Updates**: Microchip provides periodic Libero IDE updates for bug fixes. Avoid exposing the device to moisture before PCB assembly (MSL-3 rating).

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B2B Procurement Guide

1. **Suppliers**: Authorized distributors like Avnet, Digi-Key, or direct from Microchip. 2. **Lead Time**: Typically 8-12 weeks; plan for buffer stock. 3. **Certifications**: Request RoHS and REACH compliance documents. For prototypes, consider development kits (e.g., PolarFire Evaluation Kit).

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