Overview
The MPC8560CPX667LB is a member of NXP's PowerQUICC III family, combining a Power Architecture e500 core with advanced networking peripherals. It operates at 667 MHz and is housed in a 783-ball plastic ball grid array (PBGA) package. Designed for reliability in harsh environments, it supports industrial temperature ranges (-40°C to +105°C). This processor is widely used in embedded networking applications due to its balance of performance, power efficiency, and integration. It includes a double-precision floating-point unit, MMU, and 32 KB each of L1 instruction and data cache, making it suitable for complex routing and security tasks.
Structure and Working Principle
The MPC8560CPX667LB integrates a Power Architecture e500 core with a system-on-chip (SoC) architecture. The core executes instructions while dedicated hardware accelerators handle networking tasks like packet classification and encryption. A multi-layer crossbar switch connects the core to peripherals, ensuring low-latency data flow. Key subsystems include a Security Engine (SEC) for AES/DES/3DES acceleration, a QUICC Engine for legacy protocol support, and a high-speed SerDes block for serial interfaces. The chip's memory controller supports DDR1/DDR2 SDRAM, with ECC for error correction.
Key Features
The processor's 667 MHz clock speed enables throughput of over 1,000 MIPS, suitable for wire-speed packet processing. Its integrated SEC 2.2 accelerates IPsec, SSL, and other security protocols, offloading the CPU. The device includes four Gigabit Ethernet controllers with SGMII support. Other features include PCI/PCI-X interfaces, dual USB 2.0 ports, and Serial RapidIO for high-speed interconnects. The QUICC Engine supports T1/E1, HDLC, and other legacy telecom protocols, easing migration from older systems.
Application Areas
Primary applications include enterprise routers, LTE/4G base stations, and industrial gateways. Its security features make it popular in VPN appliances and firewall devices. The processor is also used in aerospace/military systems due to its radiation-hardened variants. In telecommunications, the MPC8560CPX667LB handles control-plane processing in switches and media gateways. Its real-time performance suits smart grid equipment and automotive telematics units requiring deterministic response times.
Maintenance and Precautions
Proper heat sinking is critical; the chip's typical power dissipation is 5-7W. Designers should follow NXP's layout guidelines for DDR memory and high-speed signals to avoid signal integrity issues. ESD precautions must be observed during handling. Firmware should leverage the hardware accelerators to maximize performance. NXP provides a Linux BSP and SDK for development. Long-term availability is supported via NXP's product longevity program for industrial customers.
B2B Procurement Guide
When sourcing the MPC8560CPX667LB, verify the exact part number suffix (LB indicates lead-free, industrial temp). Authorized distributors like Avnet or Arrow Electronics ensure genuine parts. Consider alternatives like the MPC8548E for lower-cost designs. Lead times vary; buffer stock is recommended for production continuity. Evaluate refurbished units for prototyping but avoid them for mission-critical deployments. NXP's direct sales team can provide volume pricing for large orders exceeding 1,000 units.
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