Overview
Medium Temperature Copper Paste is a conductive adhesive formulated with finely dispersed copper particles in a polymer or solvent base. It is designed for applications requiring sintering or curing at temperatures between 200-400°C, bridging the gap between low-temperature pastes and high-temperature metallization. Its primary role is to create reliable electrical connections in electronic components where solder alloys are unsuitable. Developed as an alternative to silver pastes, it offers cost efficiency while maintaining sufficient conductivity for many industrial uses. The paste is typically applied via screen printing or dispensing methods, followed by thermal treatment to achieve final bonding.
Physical and Chemical Properties
The paste exhibits a viscosity range of 20,000-50,000 cP, allowing precise deposition. Its electrical resistivity ranges from 5-20 μΩ·cm after curing, depending on particle size distribution and organic content. The copper content typically exceeds 70% by weight to ensure conductivity. Thermogravimetric analysis (TGA) shows decomposition of organic binders at 150-300°C, leaving a porous copper structure. Unlike silver pastes, it requires inert atmosphere (N₂/H₂) curing to prevent oxidation. X-ray diffraction confirms the formation of metallic copper networks post-sintering.
Main Applications
In photovoltaics, it serves as a front-side metallization material for silicon solar cells, replacing silver in cost-sensitive designs. Automotive applications include thick-film sensors and heater circuits, where its moderate temperature stability suits under-hood environments. The electronics industry uses it for die-attach in power modules and interconnects in printed flexible circuits. Emerging applications include 3D printed antennas and RFID tags, leveraging its compatibility with additive manufacturing processes.
Safety and Storage
While copper is less toxic than silver, the paste may contain solvents like terpineol requiring proper ventilation. OSHA permissible exposure limits (PEL) for copper dust (1 mg/m³) should be observed during handling. Storage stability is typically 6-12 months at 5-25°C in sealed containers. Freeze-thaw cycles degrade performance. Spent material disposal must follow local regulations for copper-containing waste.
B2B Procurement Guide
Technical specifications should specify: 1) Particle size (D50 <5μm preferred), 2) Curing profile (time/temperature/atmosphere), 3) Adhesion strength (>5MPa on alumina). Bulk orders (25kg+) often qualify for 15-30% discounts. Audit suppliers for ISO 9001 certification and batch-to-batch consistency testing. For hybrid circuits, request pastes with matched CTE (coefficient of thermal expansion) to ceramic substrates (6-8 ppm/°C).
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