Overview
The EP2C5T144C7N is a mid-range FPGA from Intel's Cyclone II family, offering a balance of performance and cost-efficiency. With 5,136 logic elements and 119,808 RAM bits, it suits applications requiring moderate logic density. The 144-pin Thin Quad Flat Pack (TQFP) package enables compact PCB designs while maintaining accessible pinouts for prototyping. As part of the Cyclone II series, this device emphasizes low static and dynamic power consumption, making it ideal for battery-powered or energy-sensitive systems. It supports common I/O standards like LVTTL and LVCMOS, ensuring broad compatibility with peripheral components.
Structure and Working Principle
The FPGA comprises configurable logic blocks (LABs), embedded memory blocks (M4K), and phase-locked loops (PLLs) for clock management. Each LAB contains multiple logic elements (LEs) with lookup tables (LUTs) and registers, allowing users to implement custom digital circuits via hardware description languages (HDLs). The EP2C5T144C7N operates on a 1.2V core voltage with 3.3V/2.5V I/O banks, enabling mixed-voltage system integration. During operation, the device loads a configuration bitstream from external non-volatile memory (e.g., EEPROM) to define its logic functions, offering reconfigurability for design iterations.
Key Features
Key attributes include 13 embedded 18x18 multipliers for DSP tasks, up to 150MHz internal clock speed, and four PLLs for clock synthesis/delay compensation. The device supports NIOS II soft-core processors, enabling flexible embedded system designs. Notably, its 1.2V core voltage reduces power dissipation by ~50% compared to earlier Cyclone FPGAs. The 144-pin TQFP package (20x20mm) provides 98 user I/O pins, sufficient for interfacing with sensors, displays, or communication modules in embedded applications.
Application Areas
Common uses include industrial motor control, IoT edge devices, and legacy system upgrades where custom logic replaces discrete ICs. In communications, it serves as a protocol bridge (e.g., UART to SPI) or signal conditioner. The automotive sector employs it for dashboard displays and basic ADAS functions, while consumer electronics integrate it for audio processing or display controllers. Its reconfigurability also makes it valuable for prototyping ASIC replacements in low-volume production.
Maintenance and Precautions
Prevent ESD damage by using grounded workstations and anti-static packaging during handling. Ensure soldering temperatures stay below 260°C (peak) to avoid package delamination. For unused I/O pins, configure them as outputs driving ground to minimize power leakage. Long-term reliability requires adherence to the -40°C to 100°C operating temperature range. Regular firmware validation is recommended for mission-critical applications, as configuration bitstream corruption may occur due to radiation or voltage spikes.
B2B Procurement Guide
Verify supplier authenticity via Intel’s authorized distributor list to avoid counterfeit devices. Lead times vary; consider stocking buffers for urgent orders. Request moisture sensitivity level (MSL) data if long-term storage is needed. For high-volume purchases (1k+ units), negotiate pricing based on Intel’s quarterly promotions. Evaluate secondary market options carefully—used or reclaimed FPGAs may have reduced lifespan. Always request factory-sealed trays with original lot codes.
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