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CY7C1474V25200BGXI

Updated: 2026-07-24

Overview

The CY7C1474V25200BGXI is a 36Mb synchronous pipelined SRAM device manufactured by Cypress Semiconductor (now Infineon Technologies). It features a high-speed synchronous interface with burst capability, making it suitable for applications requiring rapid data access. The device operates at 3.3V and offers industrial temperature range support (-40°C to +85°C), ensuring reliability in demanding environments. As a member of the MoBL (More Battery Life) family, this SRAM is optimized for low-power operation while maintaining high performance. Its architecture makes it particularly valuable in networking equipment, telecommunications infrastructure, and high-performance computing systems where fast memory access is critical.

Structure and Working Principle

CY7C1474V25200BGXI 电子元器件 CYPR 封装N/A 批次10+深圳市华芯购电子有限公司

The CY7C1474V25200BGXI utilizes a six-transistor (6T) SRAM cell structure that maintains data integrity without requiring refresh cycles. The synchronous interface allows for precise timing with the system clock, while the pipelined architecture enables high-speed operation up to 250MHz. The device incorporates advanced power management features including partial array refresh and deep power-down modes. The memory array is organized as 2M words × 18 bits, providing flexibility for various data width requirements. Address and control signals are registered on the rising edge of the input clock, while output data is delivered with predictable latency. This predictable timing makes the device particularly suitable for systems with strict timing requirements.

Key Features

The CY7C1474V25200BGXI offers several distinguishing features that make it suitable for industrial applications. Its operating voltage range of 3.0V to 3.6V with 2.5V I/O compatibility provides design flexibility. The device supports both linear and interleaved burst sequences, accommodating different system architectures. Power consumption is minimized through multiple operating modes: active, standby, and power-down. The typical active current is approximately 300mA at maximum frequency, while standby current drops to just 20mA. For applications requiring extended battery life, the power-down mode reduces current to 5μA (typical). These features make the device suitable for both performance-critical and power-sensitive applications.

Application Areas

This SRAM finds extensive use in networking equipment such as routers, switches, and base stations where high-speed packet buffering is required. Its predictable latency and high throughput make it ideal for quality-of-service (QoS) implementations in telecommunications infrastructure. Industrial automation systems utilize the CY7C1474V25200BGXI for real-time data processing and control applications. The device's industrial temperature range support makes it suitable for harsh environments including factory automation and transportation systems. Additional applications include medical imaging equipment, test and measurement instruments, and military/aerospace systems where reliable high-speed memory is essential.

Maintenance and Precautions

TPS613221ADBVR 集成电路(IC) TI 封装SOT23-5 批号2215+深圳市华芯购电子有限公司

Proper handling of the CY7C1474V25200BGXI requires attention to electrostatic discharge (ESD) protection measures. Industry-standard ESD protocols should be followed during installation and maintenance. The device should be stored in anti-static packaging when not in use. Thermal management is important for optimal performance and reliability. While the device includes thermal protection features, proper airflow should be maintained in the system enclosure. Designers should ensure power supply decoupling as specified in the datasheet to maintain signal integrity and prevent noise-related issues. Regular system diagnostics should include memory integrity checks to detect potential early failures.

B2B Procurement Guide

When procuring CY7C1474V25200BGXI chips in bulk, buyers should verify the manufacturer's lot code and date of manufacture to ensure freshness of stock. Lead times can vary from 4-12 weeks depending on market conditions, so forward planning is recommended. Quality assurance should include testing for proper functionality across the specified temperature range. For long-term projects, consider securing multi-year supply agreements to mitigate potential obsolescence risks. Buyers should also evaluate alternative sources or compatible devices to maintain supply chain flexibility. When comparing suppliers, consider technical support capabilities and warranty terms in addition to unit pricing.

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