Copper Tin Sputtering Target

Updated: 2026-09-19

Overview

Copper Tin Sputtering Target is a specialized alloy target material used in physical vapor deposition (PVD) processes, particularly magnetron sputtering. These targets are engineered to produce thin films with specific electrical and optical properties by combining copper's excellent conductivity with tin's corrosion resistance. The alloy composition can be customized, with common ratios ranging from 90/10 to 60/40 (Cu/Sn) depending on application requirements. Manufacturers typically produce these targets in various shapes and sizes to accommodate different sputtering systems, with purity levels often exceeding 99.9% for high-end applications.

Physical and Chemical Properties

The physical properties of Copper Tin Sputtering Targets vary significantly with the alloy ratio. Copper-rich compositions offer higher electrical conductivity, while tin-rich versions provide better corrosion resistance. The density typically falls between that of pure copper (8.96 g/cm³) and pure tin (7.31 g/cm³). Chemically, the alloy is stable under normal conditions but may oxidize when exposed to moist air over extended periods. The material shows good thermal stability up to several hundred degrees Celsius, making it suitable for high-temperature deposition processes. Its sputtering yield is generally higher than pure metals due to the alloy effect.

Main Applications

The primary application of Copper Tin Sputtering Targets is in the semiconductor industry, where they're used to deposit conductive layers for interconnects and electrodes. The alloy's properties make it particularly useful for applications requiring both conductivity and durability. In the optical industry, these targets produce anti-reflective and conductive coatings for displays and touch panels. Emerging applications include photovoltaic cells, where the alloy's properties help improve solar energy conversion efficiency. The automotive sector also utilizes these coatings for electronic components requiring reliable performance under harsh conditions.

Safety and Storage

While Copper Tin Sputtering Targets are generally safe to handle, proper precautions should be taken. Machining the targets can produce fine metal dust, requiring appropriate respiratory protection. The material presents minimal health risks in solid form but should be handled with gloves to prevent contamination. For storage, keep targets in vacuum-sealed packaging or under inert gas to prevent surface oxidation. Maintain a dry environment with stable temperature conditions. Targets should be stored vertically to prevent deformation, especially for larger sizes. Before use in sputtering systems, surface cleaning is often recommended to remove any oxidation layers.

B2B Procurement Guide

When procuring Copper Tin Sputtering Targets, clearly specify the alloy composition ratio required for your application. Standard compositions are more readily available and typically more cost-effective than custom ratios. Pay attention to the target's density and grain structure, as these significantly affect sputtering performance. Consider the bonding method if purchasing bonded targets (where the alloy is bonded to a backing plate). Request certification of analysis for purity and composition verification. Lead times can vary from weeks to months for custom specifications, so plan procurement accordingly. For reference, standard 6-inch diameter targets typically range from $500-$2000 depending on specifications and order quantity.