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CD54HCT373F3A

Updated: 2026-07-15

Overview

The CD54HCT373F3A is a high-performance octal transparent latch designed for digital systems requiring temporary data storage and bus interfacing. It belongs to the HCT family of logic devices, known for their compatibility with both TTL and CMOS voltage levels. This IC is widely used in industrial control systems, communication equipment, and computing applications due to its reliability and speed. Manufactured with silicon semiconductor technology, the CD54HCT373F3A offers eight latches with 3-state outputs, allowing multiple devices to share a common bus without interference. Its robust design ensures stable operation across a wide temperature range, making it suitable for harsh environments.

Structure and Working Principle

UCC1801J/883B 电子元器件 TI/德州仪器 封装CDIP 批次2024+诺亚方舟半导体(深圳)有限公司

The CD54HCT373F3A consists of eight D-type latches with a common latch enable (LE) and output enable (OE) control. When LE is high, the outputs follow the inputs transparently. When LE goes low, the data is latched and held until LE goes high again. The OE pin controls the 3-state outputs, enabling or disabling the bus driving capability. Internally, the device uses CMOS technology with TTL-compatible input levels, allowing seamless integration with both CMOS and TTL logic families. The 3-state outputs provide high impedance when disabled, preventing bus contention in multi-device systems. This architecture ensures efficient data transfer and reduces power consumption.

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Key Features

The CD54HCT373F3A offers several key features, including high-speed operation with propagation delays typically under 20 ns. Its wide operating voltage range (4.5V to 5.5V) makes it versatile for various digital systems. The 3-state outputs support bus-oriented applications, enabling multiple devices to share a common data bus. Additionally, the IC has high noise immunity and low power consumption, typical of HCT logic devices. Its robust construction ensures reliable performance in industrial environments, with an operating temperature range of -55°C to 125°C. These features make the CD54HCT373F3A a preferred choice for designers requiring dependable data latching and bus interfacing.

Application Areas

The CD54HCT373F3A is commonly used in microprocessor and microcontroller systems for address and data latching. It is also found in memory systems, where it acts as a buffer between the CPU and memory modules. Industrial control systems utilize this IC for interfacing sensors and actuators with control units. Communication equipment, such as routers and switches, often employ the CD54HCT373F3A for data routing and signal conditioning. Its ability to handle high-speed data makes it suitable for networking applications. Additionally, automotive electronics and test equipment leverage its reliability for signal processing and data acquisition tasks.

Maintenance and Precautions

AD5115BCPZ10-500R7 数字电位器 ADI/亚德诺 封装SOP/DIP 批次25+深圳市佳杰伟业科技有限公司

To ensure longevity, the CD54HCT373F3A should be handled with proper ESD protection, as static discharge can damage the semiconductor components. Avoid exceeding the specified voltage limits, as this can lead to permanent failure. Proper heat dissipation should be considered in high-frequency applications to prevent overheating. When designing circuits, ensure that the output enable (OE) and latch enable (LE) signals are correctly timed to avoid bus contention. Power supply decoupling capacitors should be placed close to the IC to minimize noise and stabilize operation. Following these precautions will maximize the device's performance and lifespan.

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B2B Procurement Guide

When procuring the CD54HCT373F3A, verify the supplier's authenticity to avoid counterfeit components. Check for compliance with industry standards such as RoHS and REACH. Bulk purchases may offer cost savings, but ensure the components are stored properly to prevent moisture damage. Evaluate the supplier's lead times and minimum order quantities (MOQs) to align with your production schedule. Request samples for testing before large-scale procurement. Compare prices across multiple vendors, but prioritize reliability over cost savings. Ensure the supplier provides adequate technical support and documentation.

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