CC2560AYFVR

Updated: 2026-09-12

Overview

The CC2560AYFVR is a Bluetooth dual-mode controller from Texas Instruments, designed to provide reliable wireless connectivity for embedded systems. It combines Bluetooth Classic (2.1+EDR) and Bluetooth Low Energy (BLE 4.0) support in a single chip, making it versatile for applications ranging from wireless audio to IoT sensor networks. The device features a compact form factor and integrates baseband processing, RF transceiver, and protocol stack, reducing design complexity for engineers. This IC is particularly suited for battery-operated devices due to its low-power modes and efficient RF performance. It is commonly used in conjunction with host microcontrollers, offering a standardized HCI interface for seamless integration. The CC2560AYFVR is certified for global RF regulations, simplifying compliance for product developers.

Structure and Working Principle

The CC2560AYFVR operates as a network coprocessor, handling all Bluetooth protocol layers while communicating with a host microcontroller via UART or USB interfaces. Its architecture includes a dedicated ARM processor for protocol stack execution, an RF front-end with integrated power amplifier (PA), and advanced power management circuitry. The chip supports role switching between master and slave modes, enabling flexible device pairing scenarios. Key functional blocks include the RF transceiver (operating in the 2.4GHz ISM band), baseband processor, and memory for firmware storage. The device implements adaptive frequency hopping to mitigate interference and features hardware-accelerated encryption for secure connections. Its working principle revolves around converting digital data from the host into modulated RF signals while managing link establishment and maintenance autonomously.

Key Features

The CC2560AYFVR stands out for its dual-mode Bluetooth capability, allowing simultaneous support for high-bandwidth Classic Bluetooth (up to 3Mbps with EDR) and energy-efficient BLE connections. Its RF performance includes a sensitivity of -93dBm (BLE) and output power up to +8dBm, ensuring stable links in challenging environments. The chip incorporates Texas Instruments' power-optimized design, achieving <10µA in deep sleep mode. Other notable features include comprehensive protocol support (SPP, A2DP, HFP, GATT), hardware-accelerated AES-128 encryption, and a wide operating voltage range (1.8V-3.6V). The device supports antenna diversity and includes built-in RF balun for simplified PCB layout. Factory-programmed firmware eliminates the need for stack development, significantly reducing time-to-market for end products.

Application Areas

This Bluetooth controller finds extensive use in automotive systems for hands-free calling and audio streaming, meeting stringent qualification requirements for temperature and reliability. In industrial settings, it enables wireless sensor networks and equipment monitoring with robust interference immunity. The medical field utilizes the CC2560AYFVR in portable diagnostic devices and patient monitoring systems, benefiting from its secure data transmission capabilities. Consumer applications include smart home devices (thermostats, lighting controls), wireless audio products (headsets, speakers), and PC peripherals. The chip's dual-mode operation allows hybrid applications, such as fitness trackers that use BLE for sensor data and Classic Bluetooth for audio. Its small footprint (4×4mm QFN package) makes it suitable for space-constrained designs like wearable electronics.

Maintenance and Precautions

When implementing the CC2560AYFVR, proper RF layout practices are critical—maintain impedance-controlled traces for RF lines and provide adequate ground planes. The chip requires minimal external components but careful attention to power supply decoupling (recommend 1µF+0.1µF capacitors). Thermal management is generally not required for normal operation due to low power dissipation. For long-term reliability, avoid exceeding absolute maximum ratings (4V supply voltage, 125°C junction temperature). ESD precautions should be observed during handling (HBM Class 2 compliant). Firmware updates may be available from TI to address compatibility issues or add features; check the product page periodically. In production, verify RF performance using conducted testing before final antenna integration.

B2B Procurement Guide

Industrial buyers should specify CC2560AYFVR in QFN-32 package (RHA suffix for tape-and-reel). Minimum order quantities typically start at 1,000 units, with volume discounts available above 10,000 pieces. Lead times vary from 8-12 weeks for standard orders; consider TI's distribution partners for faster turnaround. Request samples through official TI channels for evaluation. Key procurement considerations include firmware version compatibility (check with applications engineering), export control classifications (EAR99), and RoHS/REACH compliance documentation. For automotive applications, verify AEC-Q100 qualification status. Compare pricing across authorized distributors like Arrow, Avnet, and Digi-Key, noting that grey market components may lack firmware updates or reliability guarantees. Always verify part markings and purchase from TI-authorized sources to avoid counterfeits.