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CC1314R10

Updated: 2026-08-04

Overview

The CC1314R10 is a versatile wireless microcontroller developed by Texas Instruments, targeting IoT and industrial applications. It combines a powerful ARM Cortex-M4 core with RF transceiver capabilities, supporting Sub-1 GHz and Bluetooth Low Energy (BLE) connectivity. This integration makes it suitable for battery-operated devices requiring long-range communication and minimal power consumption. The CC1314R10 is part of TI's SimpleLink™ platform, offering a unified development environment with extensive software support. Its small form factor and scalability enable deployment in diverse environments, from smart agriculture to building automation. The chip's reliability and performance have made it a preferred choice for OEMs designing next-gen IoT solutions.

Structure and Working Principle

CC1314R10 电子元器件 TI/德州仪器 封装VQFN 批次22+深圳市龙宏电子科技有限公司

The CC1314R10 integrates a 48 MHz ARM Cortex-M4 processor for application tasks and a dedicated RF core for wireless communication. This dual-core architecture ensures efficient power management, allowing the RF core to operate independently while the main processor remains in low-power modes. The RF transceiver supports frequency bands from 150 MHz to 1 GHz, enabling global deployment. On-chip peripherals include ADC, GPIO, and serial interfaces (SPI, I2C, UART), facilitating sensor connectivity. The device employs TI's proprietary RF protocols or standards like Bluetooth 5.2, adapting to network requirements. Advanced features like +20 dBm output power and -121 dBm sensitivity enhance link robustness in challenging environments.

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Key Features

Ultra-low power consumption is a hallmark of the CC1314R10, with active RF modes as low as 5.5 mA (at 0 dBm) and sleep currents below 1 µA. This enables decade-long battery life in periodic transmission scenarios. The multi-protocol flexibility allows developers to switch between Sub-1 GHz (for range) and BLE (for smartphone connectivity) without hardware changes. The microcontroller offers 352KB flash memory and 32KB RAM for application code, along with hardware security features like AES-128 encryption. Its integrated DC-DC converter optimizes power efficiency across supply voltages (1.8V-3.8V). TI provides comprehensive development tools, including the SimpleLink SDK and TI-RTOS, accelerating time-to-market for IoT products.

Application Areas

Industrial IoT applications dominate CC1314R10 deployments, particularly in wireless sensor networks for condition monitoring and predictive maintenance. Its long-range capability (up to 20 km in line-of-sight) suits agricultural sensors, water metering, and oil/gas telemetry. In smart cities, the chip enables streetlight control, waste management, and parking sensors. Consumer applications include garage door openers, electronic locks, and wearable health monitors leveraging BLE. The automotive sector uses it for tire pressure monitoring systems (TPMS) and keyless entry. Medical devices benefit from its reliability in wireless patient monitoring equipment, where data integrity and battery life are critical.

Maintenance and Precautions

LM4040A30IDCKR 电压基准IC TI 封装SC70-5 批次21+深圳市龙宏电子科技有限公司

While the CC1314R10 is robust, proper PCB layout is essential for optimal RF performance. Designers should follow TI's reference designs for antenna matching and grounding to prevent signal degradation. The chip's sensitivity requires isolation from high-frequency noise sources like switching regulators. Firmware updates should be validated against the target RF environment, as regulatory certifications (FCC, CE, etc.) are protocol-specific. Developers must account for regional frequency allocations and transmit power limits. For longevity, storage should be in moisture-controlled environments (MSL3 rated), and reflow soldering profiles must adhere to TI's specifications.

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B2B Procurement Guide

When procuring CC1314R10 in volume, engage with authorized Texas Instruments distributors like Arrow or Avnet to ensure authenticity. Lead times typically range from 8-12 weeks; consider buffer stock for production continuity. Evaluate module options (e.g., TI's CC1352P) if RF design expertise is limited. For cost optimization, explore tiered pricing structures—quantities above 1K units often attract 15-30% discounts. Verify firmware compatibility across hardware revisions (check Errata sheets). Partner with TI-designated solution providers for technical support during integration. For regulatory compliance, pre-certified RF modules may reduce time-to-certification.

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